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Semtek Wafer Flux Cleaner SC-201

1 2
機能・特性
  • Cleaning of wafer gaps ≤40 µm
  • Directed / targeted cleaning
  • Process-specific nozzle replacement
  • Hybrid/combined cleaning capability
製品情報
  • MANUFACTURER
    Semtek
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    SC-201 utilizes nano-atomizing nozzles combined with a matrix cleaning approach to perform both high-pressure and atomized cleaning, customized for different products and gap dimensions. The system also allows for enhanced localized cleaning performance based on specific process requirements.
営業担当者

お気軽にお問い合わせ・ご相談ください

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw