Semtek Die Form Flux Cleaner SC-202
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機能・特性
- Substrate tilt adjustable
- Directional cleaning
- Nozzle angle adjustable
- Cleaning of wafer gaps ≤40 µm
製品情報
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MANUFACTURER
Semtek -
MANUFACTURING
Die form Flux cleaner(SC-202) -
DETAILS
Designed for 2.5D and 3D packaging processes, this system is used for flux cleaning. DIW (deionized water) can be used throughout the entire process. The tilt angles of the spray head (XYZ axes) and the Boat base plate can be adjusted according to process requirements, enabling precise cleaning of gaps to enhance productivity. Fully automated cleaning can also be configured.
営業担当者
お気軽にお問い合わせ・ご相談ください
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Yarny Lin
- Tel : 03-5530377 ext.103
- Mail : Yarny_Lin@tkk.com.tw
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Larry Chuang
- Tel : 07-3663308
- Mail : Larry_Chuang@tkk.com.tw
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Joyce Peng
- Tel : 03-5530377 ext.103
- Mail : Joyce_Peng@tkk.com.tw
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Criss Wu
- Tel : 03-5530377 ext.104
- Mail : Criss_Wu@tkk.com.tw
