Sikama Fluxless Reflow Oven EA1200
EA1200 providing safe, residue-free, high throughput fluxless soldering performance, the EA1200 sets the new high bar.
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Features
- The maximum temperature up to 400℃ and temperature uniformity ±2℃.
- The maximum substrate capacity dimensions: 12.8(L)x12.8(W) INCH
- Equipment Spec.: A. Wafer size: 8 inches & 12 inches / B. Dimensions (WxDxH, cm): 356x119x196
Product Information
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MANUFACTURER
SIKAMA -
MANUFACTURING PROCESS
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
DETAILS
Fluxless Reflow Oven (EA1200)
BUSINESS CONTACTS
If you have further needs, please contact us, we have a professional staff will serve you.
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Yarny Lin
- Tel : 03-5530377 ext.103
- Mail : Yarny_Lin@tkk.com.tw
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Larry Chuang
- Tel : 07-3663308
- Mail : Larry_Chuang@tkk.com.tw
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Joyce Peng
- Tel : 03-5530377 ext.103
- Mail : Joyce_Peng@tkk.com.tw
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Criss Wu
- Tel : 03-5530377 ext.104
- Mail : Criss_Wu@tkk.com.tw
