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Semtek Die Form Flux Cleaner SC-202

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Features
  • Substrate tilt adjustable
  • Directional cleaning
  • Nozzle angle adjustable
  • Cleaning of wafer gaps ≤40 µm
Product Information
  • MANUFACTURER
    Semtek
  • MANUFACTURING PROCESS
    Die form Flux cleaner(SC-202)
  • DETAILS
    Designed for 2.5D and 3D packaging processes, this system is used for flux cleaning. DIW (deionized water) can be used throughout the entire process. The tilt angles of the spray head (XYZ axes) and the Boat base plate can be adjusted according to process requirements, enabling precise cleaning of gaps to enhance productivity. Fully automated cleaning can also be configured.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw