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Semtek Wafer Flux Cleaner SC-201

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Features
  • Cleaning of wafer gaps ≤40 µm
  • Directed / targeted cleaning
  • Process-specific nozzle replacement
  • Hybrid/combined cleaning capability
Product Information
  • MANUFACTURER
    Semtek
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    SC-201 utilizes nano-atomizing nozzles combined with a matrix cleaning approach to perform both high-pressure and atomized cleaning, customized for different products and gap dimensions. The system also allows for enhanced localized cleaning performance based on specific process requirements.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw