Semtek Metal lift off
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Features
- Nano-atomizing nozzle
- Time-saving, no soaking required
- Exclusive patented filtration design
- Up to 75% chemical savings
- Wafer Size：8
Product Information
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MANUFACTURER
Semtek -
MANUFACTURING PROCESS
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
DETAILS
Designed for removing metals and photoresist from wafers. A nano‑scale, high‑pressure atomizing nozzle breaks the cleaning solution into ultra‑fine droplets, enabling rapid reaction with the photoresist. Simply rotate‑rinse to strip away both metal and photoresist; once dissolved, the photoresist becomes floating particles that are spun off the wafer by centrifugal force.
BUSINESS CONTACTS
If you have further needs, please contact us, we have a professional staff will serve you.
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Yarny Lin
- Tel : 03-5530377 ext.103
- Mail : Yarny_Lin@tkk.com.tw
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Larry Chuang
- Tel : 07-3663308
- Mail : Larry_Chuang@tkk.com.tw
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Joyce Peng
- Tel : 03-5530377 ext.103
- Mail : Joyce_Peng@tkk.com.tw
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Criss Wu
- Tel : 03-5530377 ext.104
- Mail : Criss_Wu@tkk.com.tw
