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Hirata Wafer Handling Robot — Vacuum Type Robot

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Features
  • Flexible combination of arm length, arm type develops various robot specifications to satisfy your request.
  • High performance ferromagnetic fluid unit provides the lowest leakage rate.
  • Airtight ferromagnetic fluid seals and mesh filter realize total particle-free condition.
  • New encoder adopted to eliminate encoder data backup battery.
  • Transferring with high repeatability and high speed makesultimate throughput performance.
Product Information
  • MANUFACTURER
    Hirata
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    Vacuum-type Wafer Transfer Robot is cleanroom compatible, fast, and precise in handling wafers.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw