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Hirata Wafer Handling Robot — Atmospheric Type Robot

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Features
  • Small footprint does not disturb down flow in the clean room.
  • High performance robot achieves higher through-put.
  • Wafer turner option allows you to process reverse side of wafer.
  • New encoder adopted to eliminate encoder data backup battery.
  • 940mm Z-axis achieved by telescopic bodystructure added to lineup.
  • It supports 450mm of the large-diameter wafer from a small diameter.
Product Information
  • MANUFACTURER
    Hirata
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    Atmospheric-type Wafer Transfer Robot is a cleanroom compatible, fast, and space-saving robot.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw