SAKI 3D Solder Paste Inspection Machine (3Si Series)
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Features
- Shares the same rigid gantry structure with Saki's 3Di-AOI.
- Rigid gantry structure and exclusive dual Y axis motor drive system.
- High resolution linear scale for accurate positioning.
- CoaXPress camera delivers higher speed and higher accuracy measurement.
- Simultaneous 2D and 3D inspection of the entire PCB surface.
- Three sensors are available with 7μm, 12μm, and 18μm resolution.
- Three machine sizes available including dual lane to support varying applications.
- Warpage management.
- Coplanarity inspection.
- SPC Function.
Product Information
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MANUFACTURER
SAKI -
MANUFACTURING PROCESS
SMT -
DETAILS
3D-SPI
BUSINESS CONTACTS
If you have further needs, please contact us, we have a professional staff will serve you.
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Kimi Chen
- Tel : 03-3529332 ext.513
- Mail : Kimi_Chen@tkk.com.tw
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Ray Lu
- Tel : 03-3529332 ext.512
- Mail : Ray_Lu@tkk.com.tw
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Allen Wu
- Tel : 03-3529332 ext.511
- Mail : Allen_Wu@tkk.com.tw
