SAKI 2D Automated Optical Inspection Systems (2Di-LU1)
Bottom-scan AOI system for automated PCB back-end production. Ensuring the quality of through-hole solder parts after dip, selective, and wave soldering, and improving productivity.
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Features
- Saki’s unique Line Scan technology
- THT solder inspection
- Extra Component Detection (ECD) inspection capability
- Extra Component Detection (ECD) inspection capability
Product Information
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MANUFACTURER
SAKI -
MANUFACTURING PROCESS
SMT -
DETAILS
2D-AOI -
Target PCB Size (mm)
Carrier: 50 W x 60 L - 610 W x 610 L -
Target PCB Size (mm)
Inspection area (Scan): 50 W x 60 L - 460 W x 500 L