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Semi auto high precision die bonder - BL100

BL100 is a versatile handing platform equipped with a beam splitter and a programmable z-axis. The BL100 has especially been designed for micro assembly applications like die bonding, sorting or assembling to be performed on a table top system.

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Features
  • Eutectic die bonding
  • Epoxy die bonding
  • Assembly of optical components (photo diodes, laser diodes)
  • MEMS/MOEMS assembly
Product Information
  • MANUFACTURER
    finconTEC
  • MANUFACTURING PROCESS
    Die Bonder
  • Details
    Die Bonder
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • Gibson Pu
    • Tel : (03)553-0377 ext.106
    • Mail : Gibson_Pu@tkk.com.tw