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Auto high precision die bonder - CL1000

The CL1000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market.

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Features
  • +/- 2 μm bonding accuracy.
  • Large number of functional application modules.
  • High precision 4 axes motion system, 3 lateral, 1 rotatory.
Product Information
  • MANUFACTURER
    finconTEC
  • MANUFACTURING PROCESS
    Multi porpose
  • Details
    Die Bonder
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • Gibson Pu
    • Tel : (03)553-0377 ext.106
    • Mail : Gibson_Pu@tkk.com.tw