Auto high precision die bonder - CL1000
The CL1000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market.
- +/- 2 μm bonding accuracy.
- Large number of functional application modules.
- High precision 4 axes motion system, 3 lateral, 1 rotatory.
MANUFACTURING PROCESSMulti porpose
If you have further needs, please contact us, we have a professional staff will serve you.
- Tel : (03)553-0377 ext.106
- Mail : Gibson_Pu@tkk.com.tw