Hirata 自动晶圆传输机 Wafer EFEM
晶圆厂设备自动化整合服务的提供，可搭配不同晶圆尺寸的设备前端自动化模块
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产品特色
- Minimum Footprint: Enables the flexible arrangement of robots, load ports and hands.
- High Throughput: Smooth and High Speed wafer handling with AC servo system and control.
- Strongly-built slider: Robust rack & pinion ensures quiet driving and lubrication-free.
- Meets Customer's Requirement with Various Options
- Particle Free: Proven Clean FOUP Opener, Smooth down air flow Enclosure & High Clean Robot.
产品信息
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原厂名称
平田 -
制程名称
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
英文名称
Wafer EFEM -
产品细目
自动晶圆传输机
