Hirata 晶圆传送机器人-大气型 Atmospheric Type Robot
具备高洁净度、省空间、高速生产性晶圆传送机器人-大气型
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产品特色
- Small footprint does not disturb down flow in the clean room.
- High performance robot achieves higher through-put.
- Wafer turner option allows you to process reverse side of wafer.
- New encoder adopted to eliminate encoder data backup battery.
- 940mm Z-axis achieved by telescopic bodystructure added to lineup.
- It supports 450mm of the large-diameter wafer from a small diameter.
产品信息
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原厂名称
平田 -
制程名称
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
英文名称
Atmospheric Type Robot -
产品细目
大气型晶圆传送机器人
