Semi auto high precision die bonder - BL100
BL100 is a versatile handing platform equipped with a beam splitter and a programmable z-axis. The BL100 has especially been designed for micro assembly applications like die bonding, sorting or assembling to be performed on a table top system.
- Eutectic die bonding
- Epoxy die bonding
- Assembly of optical components (photo diodes, laser diodes)
- MEMS/MOEMS assembly
MANUFACTURING PROCESSDie Bonder