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WEISUN AGV Auto-Oven

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Features
  • Full-Automation, Intergrate AGV/MGV & Oven, data upload to Server directly, attain Unmaaned status. (non-operator)
Product Information
  • Oven ( PLC Base ):
    A. Temperature: RT~450 degree C B. Uniformity: +/- 2 degree C C. O2 Density: <50ppm D.Cooling: N2 E. Capacity: Customerize F. Adapter EQ: AGV / MGV
  • Program:
    GUI Interface, For
  • Process:
    Wafer / Substrate Curing, PR/PI, Baking & Curing. Focus on Wafer level & Panel Fan-out solution.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • James Tsai
    • Tel : 0922186595
    • Mail : James_Tsai@tkk.com.tw