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FALCON 5/C Reflow Solder/ Curing Oven

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Features
  • Temperature Accuracy ± 2°C
  • Temperature (Standard) Up to 400°C
  • Maximum Substrate Size 5 in. x 5.75 in. (125 x 144 mm)
  • Coolant Flow 0.5 to 2 GPM (2 to 8 liters/min.)
  • O2 Level 10 PPM, 0.25 inch opening
Product Information
  • MANUFACTURER
    SIKAMA
  • MANUFACTURING PROCESS
    WLCSP
  • Details
    Reflow
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • Carter Pan
    • Tel : 03-5530377
    • Mail : carter_pan@tkk.com.tw
  • James Tsai
    • Tel : 0922186595
    • Mail : James_Tsai@tkk.com.tw
  • Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw